Note: Ingredients listed on restricted chemical lists
EC/CAS
209-136-7/556-67-2
Name of the chemical
D4
Concentration
>=0.007-<=0.012
EC/CAS
208-762-8/540-97-6
Name of the chemical
D6
Concentration
>= 0.24 - <= 0.34 %
EC/CAS
208-764-9/541-02-6
Name of the chemical
D5
Concentration
>= 0.11 - <= 0.23 %
General Information
Revision date
2020-08-31
Product name
DOWSIL Q3-1566 Heat Resistant Adhesive/
1.2.1 Relevant identified uses
Adhesive binding agents
supplier name
Sil-Mid Limited
Emergency telephone
0031 115 694 982
Icons in SDS
Company Information
company name
Sil-Mid Limited
e-mail address of the competent person responsible for the Safety Data Sheet
info@silmid.com, SDSQuestion@dow.com
Section 2
CLP CLASSIFICATION
Not a hazardous substance or mixture according to Regulation (EC) No. 1272/2008.
2.2 Label elements
Labelling according to Regulation (EC) No 1272/2008: Not a hazardous substance or mixture according to Regulation (EC) No. 1272/2008. ® ™ Trademark of The Dow Chemical Company ("Dow") or an affiliated Page 1 of 23 company of Dow
Precautionary statements
P271 Use only outdoors or in a well-ventilated area.
Additional information
EUH210 Safety data sheet available on request. EUH208
Contains
Bis[(2-ethyl-2,5-dimethylhexanoyl)oxy](dimethyl)stannane. May produce an allergic reaction.
2.3 Other hazards
This product contains octamethylcyclotetrasiloxane (D4) that has been identified by the Member State Committee of ECHA as fulfilling the PBT and vPvB criteria laid down in Annex XIII to Regulation (EC) No 1907/2006. See Section 12 for additional information. This product contains dodecamethylcyclohexasiloxane (D6) that has been identified by the Member State Committee of ECHA as fulfilling the vPvB criteria laid down in Annex XIII to Regulation (EC) No 1907/2006. See Section 12 for additional information. This product contains decamethylcyclopentasiloxane (D5) that has been identified by the Member State Committee of ECHA as fulfilling the vPvB criteria laid down in Annex XIII to Regulation (EC) No 1907/2006. See Section 12 for additional information.
