Note: Ingredients listed on restricted chemical lists
EC/CAS
144413-22-9
Name of the chemical
Complex reaction mass of Chinese gum rosin post reacted with acrylic acid
Concentration
N/A
EC/CAS
7440-22-4
Name of the chemical
Silver
Concentration
N/A
EC/CAS
7440-50-8
Name of the chemical
Copper
Concentration
N/A
EC/CAS
231-131-3
Name of the chemical
Colloidal silver (nano) [INCI] (11)
Concentration
N/A
EC/CAS
231-159-6
Name of the chemical
Copper (nano) [INCI] (11), Colloidal Copper (nano) [INCI] (11)
Concentration
N/A
General Information
Revision date
2015-11-26
Product name
LPKF Dispense Solder Paste
1.2.1 Relevant identified uses
Lead-free solder paste for dispensing with LPKF ProtoMat machines
supplier name
LPKF Laser & Electronics AG
Emergency telephone
(24/7) +49 551 38318-66
Icons in SDS
Company Information
company name
LPKF Laser & Electronics AG
e-mail address of the competent person responsible for the Safety Data Sheet
info@lpkf.com
GHS Information
Signal word
Danger
Hazard Codes
Hazard statements (CLP)
H318
Hazard statements
Code
Statements
H318
Causes serious eye damage
Section 2
Other physicochemical hazards
Human health Eye Dam. 1 H318 Causes serious eye damage.
2.2 Label elements
Labelling according to Regulation (EC) No. 1272/2008 [CLP]
Signal word
Danger
Contains
2-(2-hexyloxyethoxy)ethanol
Hazard statements
H318 Causes serious eye damage.
Precautionary statements
P280 Wear protective gloves and eye protection. P305+P351+P338 IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing. P310 Call a POISON CENTER or doctor/physician immediately. Other label elements none 2.1
Results of PBT and vPvB assessment
The substance does not meet the criteria for classification as PBT or vPvB.
