Note: Ingredients listed on restricted chemical lists
EC/CAS
65997-06-0
Name of the chemical
rosin, hydrogenated
Concentration
5-10%
EC/CAS
203-988-3/112-59-4
Name of the chemical
2-(2-hexyloxyethoxy)ethanol
Concentration
3-5%
EC/CAS
231-131-3/7440-22-4
Name of the chemical
Silver
Concentration
3-5%
EC/CAS
231-159-6/7440-50-8
Name of the chemical
Copper
Concentration
≤1.0%
General Information
Revision date
2015-04-09
Product name
NP505-HR Lead-Free Solder Paste
Icons in SDS
Company Information
company name
Kester Inc
e-mail address of the competent person responsible for the Safety Data Sheet
EHS_Kester@kester.com
GHS Information
Signal word
Warning
Hazard Codes
Hazard statements (CLP)
H315, H319, H335
Hazard statements
Code
Statements
H315
Causes skin irritation
Section 2
CLP CLASSIFICATION
GHS07 Skin Irrit. 2 H315 Causes skin irritation. Eye Irrit. 2 H319 Causes serious eye irritation. STOT SE 3 H335 May cause respiratory irritation.
2.2 Label elements
Labelling according to Regulation (EC) No 1272/2008 The product is classified and labelled according to the CLP regulation.
Hazard pictograms
GHS07
Hazardous Ingredients
Rosin, hydrogenated Hexyl diglycol
Hazard statements
Causes skin irritation. Causes serious eye irritation. May cause respiratory irritation.
Precautionary statements
Wear protective gloves / eye protection. IF SWALLOWED: rinse mouth. Do NOT induce vomiting. IF INHALED: Remove victim to fresh air and keep at rest in a position comfortable for breathing. IF ON SKIN: Wash with plenty of soap and water. Store in a well-ventilated place. Keep cool. Dispose of contents/container in accordance with local/regional/national/international regulations. (Continued on page 2) GB (Continued from page 1)
Additional information
Restricted to professional users.
PBT Substances
Not applicable
vPvB Substances
Not applicable *
