Note: Ingredients listed on restricted chemical lists
EC/CAS
7440-22-4
Name of the chemical
Silver
Concentration
55-85%
EC/CAS
7440-50-8
Name of the chemical
Copper
Concentration
N/A
EC/CAS
10043-35-3
Name of the chemical
Borsäure Borsäure
Concentration
5%
EC/CAS
7789-23-3
Name of the chemical
Potassium fluoride
Concentration
5%
General Information
Revision date
2023-03-22
Product name
NANO Paste, Silver Solder Paste w/ Dispensing Syringe
1.2.1 Relevant identified uses
For Soldering Operations
Icons in SDS
Company Information
company name
Bench Basics
GHS Information
Signal word
Danger
Hazard Codes
Hazard statements (CLP)
H360
Hazard statements
Code
Statements
H360
May damage fertility or the unborn child
Section 2
SECTION 2: Hazards identification
Classification of the substance or mixture This product does not meet the criteria for classification in any hazard class according to US Consumer product safety comissions guideline at 16 CFR 1500.135 and the criteria outlined in ASTM D-4236 Label elements Pictogram None needed according to classification criteria
Signal word
Danger Hazard Statement H360: May damage fertility or the unborn child
Precautionary statements
P201: Obtain special instructions before use. P202: Do not handle until all safety precautions have been read and understood. P280: Wear protective gloves/protective clothing/eye protection/face protection. P308+311 IF exposed or concerned Get medical advice/ attention P405: Store locked up. P501: Dispose of contents/ container to an approved waste disposal plant.
2.3 Other hazards
Not classified as hazardous as supplied.
2.1 Classification of the substance or mixture
This product does not meet the criteria for classification in any hazard class according to US Consumer product safety comissions guideline at 16 CFR 1500.135 and the criteria outlined in
